在测试高功率LED时，我没有预料到的微妙热因素
我一直在开放的非商业环境中实验高功率LED，以更好地理解成品之外的实际热行为。<p>让我印象深刻的是，非电气细节对稳定性的影响是多么显著：
– 安装压力
– 接口材料
– 实际气流路径与假设路径的差异<p>在电气方面，一切都保持在额定范围内，但长期的热行为却比预期的变化更大。<p>对于那些曾与高功率密度硬件打过交道的人来说：
哪些热假设在实践中被证明是错误的？
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I’ve been experimenting with high-power LEDs in open, non-commercial setups to better understand real-world thermal behavior outside finished products.<p>What stood out was how strongly non-electrical details affected stability:
– mounting pressure
– interface materials
– real airflow paths versus assumed ones<p>Electrically everything stayed within ratings, but long-term thermal behavior varied more than expected.<p>For those who’ve worked with power-dense hardware:
what thermal assumptions turned out to be wrong in practice?